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Mbga IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Option:M IP8 i Intel stencil Redmi Note 4X Redmi Note 4X 12 Pro 12 Pro max mold The compatible model is iPhone 7 7P 8 8P X XS XS MAX XR 11 11 Pro 11 Pro Max 12 12 mini 12 Pro 12 Pro Max 13 13 Pro 13 mini 13 Pro Max 14 14 Pro 14 Pro Max 15 15 Plus 15 Pro 15 Pro Max AMAOE Mbga IP WiFi Baseband CPU NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7 15 Pro Max
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Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Option:M-IP8-i Intel stencil Redmi Note 4X

Item no : 45288252147
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US$ 49.99
Pay in 4 interest-free payments of $12.50 Learn more
Min. order: 1piece

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Oct 25 - Oct 30

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US$ 49.99

1-11

US$ 44.99

12-35

US$ 34.99

36-59

US$ 29.99

60+

US$40

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Shipping Notes
  • Free Standard Shipping on $100+ Orders to the USA.
  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
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Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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